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LastUpdate Última actualización 18/11/2025 [07:21:00]
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Solicitudes publicadas en los últimos 30 días / Applications published in the last 30 days (Publicaciones Chinas excluidas /Chinese publications excluded).
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重合性組成物およびインクジェット用インクならびに硬化物および電子部品

NºPublicación:  JP2025160468A 22/10/2025
Solicitante: 
JNC株式会社
JP_2025160468_PA

Resumen de: US2023203222A1

A polymerizable composition curable by ionizing radiation contains (A) a first component including a (meth)acryloylmorpholine represented by formula (1), and (B) a second component including a compound represented by formula (2). The total content of the first component and the second component in the polymerizable composition is 50 wt % or more. The polymerizable composition enables appropriate maintaining of a post-curing shape even after being in a high temperature environment, and enables dissolution thereof by a water-containing solution. In formula (1), R1 is hydrogen or methyl. In formula (2), R2 is hydrogen or a group having 1 to 6 carbons, R3 and R4 are each independently hydrogen or a group having 20 or less carbons, and n is an integer of 1 to 6.

코팅 조성물, 비전도성 코팅, 비전도성 필름, 이들의 물품, 이들의 제조 방법 및 이들의 사용 방법

Nº publicación: KR20250150610A 20/10/2025

Solicitante:

피피지인더스트리즈오하이오인코포레이티드

CN_120858149_PA

Resumen de: MX2025010720A

Coating compositions, non-conductive coatings, non-conductive films, articles thereof, methods of manufacture thereof, and methods of use thereof are provided. The coating composition comprises a film-forming resin and a conductive additive. A coating formed from the coating composition has an irreversible increase in resistivity of at least 20%, at least 50%, at least 100%, at least 500%, at least 1,000%, at least 10,000%, at least 100,000%, or at least 300,000%, all as measured with a probe prior to and after exposing the coating to an external stimulus.

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